International Conference on Electronics Packaging and Assembly Engineering - (IC-EPAE-27)


14th - 15th June, 2027 | Seoul, South Korea

Multi-format (In-person/Virtual)

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Important Dates

Pre-registration Deadline

15th May, 2027

Paper Submission Deadline

20th May, 2027

Last Date Of Registration

30th May, 2027

Date Of Conference

14th - 15th June, 2027

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Sample Abstract
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Call for Papers

The (IC-EPAE-27) is dedicated to advancing research excellence by bringing together leading scholars, scientists, and professionals from across the globe. It provides a platform for the dissemination of high-quality research and innovative methodologies.

With a strong focus on Electrical and Electronics Engineering, the conference promotes research that contributes to academic depth, practical insights, and interdisciplinary knowledge integration.

Authors are invited to submit papers addressing, but not limited to, the following areas:

  • Advancements in electronics packaging technologies
  • Thermal management in electronics packaging
  • Reliability testing for electronic assemblies
  • Sustainable practices in electronics packaging
  • Integration of IoT in packaging systems
  • Challenges in electronics assembly processes
  • Quality control in electronics packaging
  • Emerging materials for electronics packaging
  • Design considerations for electronic assemblies
  • Automation in electronics manufacturing
  • Future trends in electronics packaging
  • Supply chain management for electronics assembly
  • Impact of 5G on electronics packaging
  • Electromagnetic compatibility in packaging
  • Case studies in electronics packaging engineering
  • Packaging solutions for wearable electronics
  • Robustness of electronic assemblies
  • Testing methodologies for electronics packaging
  • Industry standards for electronics packaging
  • Research directions in electronics assembly

Peer Review Process

All submissions will be evaluated through a structured peer-review process to ensure academic rigor and contribution to the field. Accepted papers will be presented and may be considered for publication in high-quality journals and indexed conference proceedings.

Registration Details

Secure your participation by completing the registration process at the earliest. Limited presentation slots are allocated on a first-come, first-served basis.

Publication Opportunities

High-quality submissions will be prioritized for publication opportunities in recognized journals and indexed proceedings.

Submit Your Paper Today Register Early & Reserve Your Slot