International Conference on Electronics Packaging and Assembly Engineering - (IC-EPAE-27)


14th - 15th June, 2027 | Seoul, South Korea

Multi-format (In-person/Virtual)

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Important Dates

Pre-registration Deadline

15th May, 2027

Paper Submission Deadline

20th May, 2027

Last Date Of Registration

30th May, 2027

Date Of Conference

14th - 15th June, 2027

Downloads

Conference Flyer
Sample Abstract
Sample Full Paper

Tentative Venue Details :

Four Seasons Hotel,
97 Saemunan-ro, Dangju-dong,
Jongno District, Seoul,
South Korea